Application Note

Reinventing Linear Regulation for Space: Enhancement-Mode GaN-on-Silicon Power FETs × Enhanced Linear Regulators

Application Note PSAN006

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Introduction

Spacecraft reserve linear regulators for the loads that can least tolerate noise: the local oscillators and low-noise amplifiers of RF and microwave front ends, the reference clocks behind high-speed data links, the receivers in electronic warfare and signals intelligence payloads, and the detectors in optical and precision-sensing instrumentation. A low-dropout linear regulator (LDO) generates no switching ripple of its own, attenuates the ripple that arrives at its input, and radiates nothing, because its pass transistor conducts continuously instead of switching.

Despite these benefits, two key drawbacks have limited the use case for linear regulation in space. First, the pass transistor has to survive the radiation environment; this has historically necessitated a radiation-hardened silicon MOSFET, with the single-event vulnerabilities as well as the size and on-resistance limitations of an aging power electronics technology [1]. Second, the entire input-to-output voltage difference is dissipated as heat, holding efficiency close to the ratio VOUT/VINV_{\mathrm{OUT}}/V_{\mathrm{IN}}, so an LDO has only been practical for small voltage steps; larger steps, step-up, and voltage inversion have belonged to switching regulators, along with the inductors, filtering, and spectral clean-up challenges they bring.

EPC Space’s radiation-hardened enhancement-mode gallium nitride (eGaN) transistor addresses the constraint imposed by radiation survivability. Radiation-hardened silicon MOSFETs carry two ways for a single heavy ion to destroy them: it can rupture the thin gate oxide, or it can generate a cloud of holes and electrons in the drift region that burns the device out. An eGaN device has no gate oxide and no efficient path for hole conduction, so neither mechanism has anything to act on [1]. EPC7014, the pass transistor on every board in this note, is rated immune to single-event effects up to a linear energy transfer (LET) of 83.2 MeV·cm2/mg with the drain held at its full rated voltage, immune to total ionizing dose (TID) at both low and high dose rates, and it brings the low on-resistance and small footprint of a lateral GaN device to the pass element [2].

Polaris Semiconductor’s Enhanced Linear Regulator (ELR) addresses the second constraint by recovering most of the power a linear regulator would otherwise dissipate. Optocouplers with high power-transfer efficiency, placed in series with the pass transistor, convert part of the voltage drop into light, and their photovoltaic cells return that light to the output as current. Arranged one way, the optocouplers lift a step-down regulator’s efficiency well above the VOUT/VINV_{\mathrm{OUT}}/V_{\mathrm{IN}} theoretical maximum of a conventional LDO; arranged another, their photovoltage augments the input to boost it, or extends below ground to produce a negative rail. Nothing switches in any of these configurations, so there is no switching ripple, no radiated emissions, and no inductor. The optocouplers are radiation-resilient by design, retaining most of their efficiency through high displacement damage doses and largely unaffected by TID and single-event phenomena [3].

In this application note, EPC Space and Polaris Semiconductor built four demonstration boards on one common design: an LDO baseline with no optocouplers, and Buck, Boost, and Inverting ELRs that each add two Polaris OC1D optocouplers. The LDO supplies a 1.8 V rail from a nearby input; the Buck ELR supplies the same rail from 5 V; the Boost ELR lifts a single-cell Li-ion battery to 5 V; and the Inverting ELR turns that same battery into a −1.8 V rail, all with one eGaN pass transistor and one controller. The sections that follow walk through the shared design and what changes between variants, then compare the boards on the basis of electrical, thermal, and noise performance.

eGaN × ELR Implementation

We built four designs for this application note: LDO, Buck ELR, Boost ELR, and Inverting ELR. Their target operational ranges are reported in Table 1 and simplified schematics are shown in Figure 1. For all designs, Analog Devices LT1575 [4], an ultrafast linear controller, drives EPC Space’s EPC7014 radiation-hardened eGaN HEMT [2]. LT1575 was chosen for its applicability to driving n-channel FETs as source followers and can be configured for 5 V gate drive—well-suited to EPC7014—along with its suite of features that we will expand upon below.

Four simplified schematics labelled LDO, Buck ELR, Boost ELR, and Inverting ELR. In each, the LT1575 controller, powered from a separate VCC input, drives the gate of the EPC7014 eGaN transistor, whose drain connects to VIN, and a resistor divider feeds the controller's FB pin. In the LDO the transistor source connects directly to VOUT. The Buck ELR adds two OC1D optocouplers: their LEDs sit in series between the transistor source and VOUT, and their photovoltaic (PV) cells connect from ground to VOUT. In the Boost ELR the LEDs run from the transistor source to ground and the PV cells sit between VIN and VOUT. In the Inverting ELR the LEDs again run from the source to ground, and the PV cells connect from ground down to the negative output, labelled −VOUT.
Figure 1. Simplified schematics of the four eGaN designs: LDO, Buck ELR, Boost ELR, and Inverting ELR. Each ELR extends the LDO base design with two OC1D optocouplers. Current-sense, compensation, gate-clamp components, and miscellaneous passives are omitted for clarity.

A dedicated bias rail (VCCV_{\mathrm{CC}}) powers LT1575, whose feedback is set by a resistor divider connected between the output and ground. The three ELR variants extend the LDO base design, adding discrete Polaris OC1D optocouplers between the eGaN source, output, and ground terminals1 to enable a variety of regulated outputs—from efficient step-down across larger input-to-output differences (Buck ELR), to voltage boost (Boost ELR) and inversion (Inverting ELR). For a comprehensive understanding of ELR device operation, PSWP001 [3] details both Buck and Boost modes, and PSAN005 [5] details Inverting ELRs.

Table 1. Typical input and output voltages of the four designs in this application note.
ConfigurationTypical Input RangeNominal Output
LDO2–3 V1.8 V
Buck ELR4.8–6 V1.8 V
Boost ELR3.3–4.2 V5.0 V
Inverting ELR2.9–5 V−1.8 V

Shared Design Elements

Full schematics for each board are provided in Figures A1–A4. Regulation operates through the same basic principles across all variants: LT1575’s (U1) error amplifier compares its FB pin against an internal 1.21 V reference and continuously adjusts the gate of EPC7014 (Q1). This is entirely representative of the regulation scheme in conventional LDOs; here it is separated into discrete controller and pass transistor elements.

By including a VCCV_{\mathrm{CC}} rail separate from VINV_{\mathrm{IN}}, we have taken the controller and gate drive out of the power path. This minimizes the required headroom for conventional LDO operation—the dropout is set by the FET’s on-resistance rather than gate-drive headroom. The GATE pin of U1 swings to within approximately 1.6 V of VCCV_{\mathrm{CC}} (worst case; typically within 1 V), so the bias rail must satisfy:

VCC>VS+VGS+1.6 V(1)V_{\mathrm{CC}} > V_{S} + V_{\mathrm{GS}} + 1.6\,\mathrm{V} \tag{1}

where VSV_{S} is the potential at Q1’s source and VGSV_{\mathrm{GS}} is the gate-to-source voltage (Q1 is fully enhanced at VGSV_{\mathrm{GS}} = 5 V). In the LDO design, the source ties directly to the output, giving VCCV_{\mathrm{CC}} > 8.4 V for fully enhanced operation at VOUTV_{\mathrm{OUT}} = 1.8 V; at moderate load and with adequate headroom, we found VCCV_{\mathrm{CC}} = 6 V sufficient in practice. The ELR variants relocate Q1’s source relative to the rails, with LED strings sitting directly in the pass-transistor path. Consult Table 2 for minimum recommended VCCV_{\mathrm{CC}} voltage in these configurations. VfV_{f} represents the forward voltage across the series-connected LEDs (approximately 3.0 V, or 1.5 V per LED under high injection). For the results detailed herein, all boards had 12 V bias applied to VCCV_{\mathrm{CC}} unless noted otherwise.

Table 2. Minimum recommended bias rail voltage for fully enhanced operation.
ConfigurationQ1’s Source Potential (VSV_{S})Minimum VCCV_{\mathrm{CC}}, Fully Enhanced
LDOVOUTV_{\mathrm{OUT}}8.4 V
Buck ELRVOUT+VfV_{\mathrm{OUT}} + V_{f}11.4 V
Boost ELRVfV_{f}9.6 V
Inverting ELRVfV_{f}9.6 V

Because VCCV_{\mathrm{CC}} sits well above Q1’s source, the GATE pin can drive VGSV_{\mathrm{GS}} past the +6 V absolute maximum rating of the EPC7014, a limit that must not be exceeded with GaN FETs [6]. Zener diode D1, connected from gate to source, clamps VGSV_{\mathrm{GS}} to 5.1 V during enhancement; its forward drop keeps negative excursions inside Q1’s −4 V reverse rating. A small series gate resistor (R1, 12.4 Ω) damps high-frequency ringing at the gate node for FETs with low input capacitance, per LT1575 datasheet recommendations [4].

We placed a 40 mΩ resistor (R5) in the power path between the IPOS and INEG terminals of U1. This triggers the controller’s current limit feature when the potential between those terminals reaches 50 mV. R5 therefore limits the pass transistor current to approximately 1.25 A. In the LDO this is the output current limit2. Q1’s on-resistance (RDS(on)R_{\mathrm{DS(on)}}) is specified as 340 mΩ typical (1 A drain current, VGSV_{\mathrm{GS}} = 5 V, and 25 °C), so the two elements in series set a total VINV_{\mathrm{IN}}-to-Q1-source drop of approximately 380 mV at full 1 A load3. In many applications, the added benefit of a current limiting feature outweighs the drawback of the additional tens-of-mV drop. Note that RDS(on)R_{\mathrm{DS(on)}} carries a positive temperature coefficient, reaching roughly 1.7× its room-temperature value at 125 °C. Dropout budget should be evaluated at the anticipated operating temperature.

U1’s SHDN pin is connected to ground via R6 using a 0 Ω jumper, defeating the current limit’s latchoff timer. In doing so, current limiting is implemented as a continuous clamp rather than a latching shutdown. Timed latch-off can be restored by swapping R6 for a high-impedance resistor or leaving it open, and populating C9 (unpopulated in reference design)4.

Loop compensation follows LT1575 datasheet’s recommended series RC-plus-capacitor (type-II) network: R2 (7.32 kΩ) in series with C2 (1000 pF) from the COMP pin to ground, with C1 (10 pF) in parallel. Properly compensated, the ultrafast error amplifier maintains tight regulation with all-ceramic output capacitors—C5 is a single 22 µF ceramic, with no bulk tantalum or electrolytic capacitance required. Input and bias bypassing are handled by 1 µF ceramics C3 and C4 on VINV_{\mathrm{IN}} and VCCV_{\mathrm{CC}}, respectively. Unpopulated positions C7, C8, and C10 (C11 on the Inverting board) accommodate additional output and input capacitance if desired. All fitted capacitors use X7R or C0G dielectrics, chosen for their stable capacitance across temperature.

The output voltage is programmed by the voltage divider: R3 connects between the output and U1’s FB pin, R4 between the FB and ground. A 47 nF feedforward capacitor (C6) is used to improve transient response and minimize output noise. For the positive-output designs, VOUTV_{\mathrm{OUT}} = 1.21 V × (1 + R3/R4); R3 = 2.26 kΩ and R4 = 4.64 kΩ give 1.8 V for the LDO and Buck ELR. The Inverting ELR retains the same three components but rearranges the reference—as described in the Inverting ELR paragraph below.

From LDO to ELR

Each variant is built on the same foundational bill of materials (BoM), collected in Table A1. Moving from the LDO to any of the ELRs populates optocouplers U2 and U3, reroutes Q1’s source and the optocoupler terminals, and, where the output voltage differs (Boost and Inverting ELRs), changes R3 and R4 values. These adjustments, along with relatively minor layout shifts, were all that was necessary for the broad range of regulation schemes demonstrated. This highlights the adaptability of the optocoupler-enhancement technique and the ease of ELR design-in as an extension of baseline LDO design. Table 3 collects the circuit relations that follow from rewiring. Here, VfV_{f} is the forward drop of the two series-connected LEDs; VDOV_{\mathrm{DO}} is the drop across R5 and Q1; and CTR is the optocoupler current transfer ratio—the PV photocurrent divided by the LED current that produced it. Load current (ILOADI_{\mathrm{LOAD}}) is the magnitude delivered to the load. The current ratios neglect the divider current and the controller supply current, which is drawn from VCCV_{\mathrm{CC}} rather than VINV_{\mathrm{IN}}. All three ELR boards connect the two LEDs in series and the two PVs in series, and the current ratios in Table 3 assume this arrangement. Parallel arrangements optimize performance for different operating regimes, and PSWP001 generalizes the Buck and Boost relations to any series–parallel combination [3].

Table 3. Circuit relations for the LDO and the three ELR variants.
ConfigurationLED stringPV stringPV string voltageTurn-on voltage (VONV_{\mathrm{ON}})IIN/ILOADI_{\mathrm{IN}}/I_{\mathrm{LOAD}}ILOADI_{\mathrm{LOAD}} carried by
LDO———VOUT+VDOV_{\mathrm{OUT}} + V_{\mathrm{DO}}11Q1
Buck ELRSource to OUTGND to OUTVOUTV_{\mathrm{OUT}}VOUT+Vf+VDOV_{\mathrm{OUT}} + V_{f} + V_{\mathrm{DO}}1/(1+CTR)1/(1+\mathrm{CTR})Q1 and PVs
Boost ELRSource to GNDIN to OUTVOUT−VINV_{\mathrm{OUT}} - V_{\mathrm{IN}}Vf+VDOV_{f} + V_{\mathrm{DO}}1+1/CTR1 + 1/\mathrm{CTR}PVs
Inverting ELRSource to GNDOUT to GND∣VOUT∣|V_{\mathrm{OUT}}|Vf+VDOV_{f} + V_{\mathrm{DO}}1/CTR1/\mathrm{CTR} aPVs
  1. a See the section entitled “Design Note: Inverting ELR and Implied CTR” for a more nuanced discussion related to this expression.

In the Buck ELR, the LED array sits between Q1’s source and the output; the PV pair sits between ground and the output, in parallel with the load. In this way, the load current is the sum of the pass-transistor current and the photocurrent. The input supplies only the LED share, IIN=ILOAD/(1+CTR)I_{\mathrm{IN}} = I_{\mathrm{LOAD}}/(1 + \mathrm{CTR}), which is how an ELR exceeds the VOUT/VINV_{\mathrm{OUT}}/V_{\mathrm{IN}} efficiency ceiling of a conventional LDO [3]. The turn-on voltage (VONV_{\mathrm{ON}}) rises by VfV_{f}, marking another key distinction from conventional LDOs: the latter suits small input-to-output steps, where little power is lost in the pass transistor. The Buck ELR is designed for larger steps, where the LEDs convert the drop into light that the PV elements return to the output as current. Note that the R5 current limit now bounds the LED current, rather than the load current, so the load current limit becomes approximately 1.25 A × (1 + CTR).

The Boost ELR moves the LED pair to ground and the PV pair to the input, such that the PV voltage adds to VINV_{\mathrm{IN}}, thereby achieving boost conversion with no inductor and no switching. The divider still sets the output; R3 = 7.15 kΩ and R4 = 2.26 kΩ give 5.04 V. The loop drives LED current until the PV pair produces the difference VOUT−VINV_{\mathrm{OUT}} - V_{\mathrm{IN}}. By applying two optocouplers with series-connected PV elements, the Boost ELR covers the step from a single-cell Li-ion input of 3.3–4.2 V to 5 V. All of the load current passes from the input through the PV array, so the input current equals the load current plus the LED current, IIN=ILOAD (1+1/CTR)I_{\mathrm{IN}} = I_{\mathrm{LOAD}}\,(1 + 1/\mathrm{CTR}). The turn-on voltage loses its VOUTV_{\mathrm{OUT}} term, because the LEDs are now connected to ground. Q1’s source rests at VfV_{f} above ground, which is the origin of the 9.6 V entry in Table 2. A fuller treatment of linear boost operation is given in PSAN001 [7] and PSWP001 [3].

The Inverting ELR keeps the LED placement of the Boost ELR and moves the PV pair from between the input and output to between ground and the output. Its positive terminal is tied to ground; its negative terminal becomes the −VOUT-V_{\mathrm{OUT}} rail, following the negative voltage arrangement in the OC1D datasheet [8]. All of the load current again passes through the PV array, so Q1 carries ILOAD/CTRI_{\mathrm{LOAD}}/\mathrm{CTR}. Because U1’s FB pin must sit 1.21 V above its GND pin, we tie the latter pin to the −1.8 V output and the divider spans from system ground to that rail. This necessitates swapping the R3 & R4 resistor values relative to the LDO and Buck ELR boards: R3 = 4.64 kΩ and R4 = 2.26 kΩ. The SHDN circuit and compensation network both return to the −1.8 V output rail as well. The bias rail is still applied relative to system ground, so the 9.6 V minimum VCCV_{\mathrm{CC}} in Table 2 holds, with U1 seeing 11.4 V across its own supply pins.

All four boards share the same 82.6 mm × 63.5 mm four-layer outline. Figure 2 shows the assembled boards.

Photograph of the LDO demonstration board: a green four-layer board with turret terminals for IN, GND, OUT, VBIAS and its ground return, the EPC7014 transistor (Q1) and LT1575 controller (U1) at the center, and EPC Space and Polaris Semiconductor logos. The silkscreen reads LDO, eGaN Conventional Linear Regulator, EPC7014, 2.5 V to 1.8 V.
(a) LDO
Photograph of the Buck ELR demonstration board: the same green board and terminal layout as the LDO, with two square optocoupler packages (U2 and U3) added beside the EPC7014 and LT1575. The silkscreen reads Buck, eGaN Enhanced Linear Regulator (ELR), EPC7014 × OC1D, 5 V to 1.8 V.
(b) Buck ELR
Photograph of the Boost ELR demonstration board: the same green board with the two optocoupler packages U2 and U3 beside the EPC7014 and LT1575. The silkscreen reads Boost, eGaN Enhanced Linear Regulator (ELR), EPC7014 × OC1D, 3 V to 5 V.
(c) Boost ELR
Photograph of the Inverting ELR demonstration board: the same green board with the two optocoupler packages U2 and U3 beside the EPC7014 and LT1575, and the output terminals swapped so that GND sits at the top right and OUT below it. The silkscreen reads Inverting, eGaN Enhanced Linear Regulator (ELR), EPC7014 × OC1D, 3 V to −1.8 V.
(d) Inverting ELR
Figure 2. All four eGaN × ELR demonstration boards.

Measured Performance

Electrical tests are summarized in Figure 3 for all demonstration boards. Each topology tile stacks output voltage (top) over efficiency (bottom) on a shared input voltage axis. Unless otherwise specified, electrical tests in this application note do not account for the separate bias rail current, which is typically ≈ 12 mA or less [4].

Output voltage and efficiency versus input voltage for the four boards, with one line per load current. Top: the LDO (dotted lines, 50 to 900 mA) regulates 1.8 V from about 1.7 to 2.3 V input, and its efficiency falls from about 97% as the input rises; a gray dotted projection continues the LDO efficiency down to about 36% at 5 V. The Buck ELR (solid lines) regulates 1.8 V from about 4.3 to 5.3 V input depending on load, with efficiency peaking near 65% and easing to about 45 to 50% at 6 V. Bottom left: the Boost ELR regulates 5 V from about 2.8 to 3.35 V input at 50 to 350 mA, with efficiency peaking in the mid-60s and falling to about 50% at 4.2 V. Bottom right: the Inverting ELR regulates −1.8 V from about 2.7 to 3 V input at 25 to 150 mA, with efficiency between about 20% and 39%, higher at heavier loads.
Figure 3. Output voltage (top panels) and efficiency (bottom panels) versus input voltage for all four demonstration boards, 25 °C operation. Each line represents a different load current. Bias rail current (≈ 12 mA) was not included in the efficiency calculation. The gray dotted line projects the LDO efficiency beyond the measured sweep: in regulation a linear regulator draws an input current that is independent of VINV_{\mathrm{IN}}, so efficiency falls as 1/VIN1/V_{\mathrm{IN}} from each load's last measured point at 3.0 V. The LDO was not measured directly at 5 V input to avoid thermal damage to Q1.

The top set of panels in Figure 3 shows the electrical performance of both the LDO and Buck ELR on shared axes. Given that both boards regulate 1.8 V output, the subplots provide a visual aid in ascertaining the optimal operating regime of each design. The LDO (dotted lines) is highly efficient and capable of regulation when the input voltage is only slightly above the output. The Buck ELR (solid lines), on the other hand, turns on at a higher input, as expected from the LED forward drop, but reaches far higher efficiency in its own operating regime. For comparison, stepping 5 V to 1.8 V is only about 36% efficient using an LDO; with the Buck ELR, efficiency is approximately 60% (precise value is load-current dependent)—a 67% relative increase5.

The bottom left and right panels show complementary electrical performance summaries for the Boost ELR and Inverting ELR, respectively. Efficiencies are only plotted above the turn-on voltage to avoid calculation artifacts associated with the extremely sharp sub-regulation output voltage swing. The Boost ELR is able to achieve approximately 60% efficiency for a single-cell Li-ion step to 5 V (from 3.5 V to 5 V), whereas the Inverting ELR converts 3.5 V to −1.8 V with lower efficiency in the range of mid-20s-to-mid-30s percent. It is worth noting that negative rails are often just needed to set a negative bias point and therefore draw very little current. In these cases, electrical efficiency is of minimal concern when compared with power integrity (zero switching spurs, extremely low output noise) and footprint/BoM. For these designs the Inverting ELR offers a switching-free negative rail at a cost of two optocouplers and no inductor.

Table 4. Measured input current to supply a 100 mA load (not including U1's bias rail current a^{\mathrm{a}}). Input current reported at an input voltage above turn-on during 25 °C test. Implied CTR neglects the feedback-divider current (below 0.6 mA in every design).
ConfigurationInput CurrentImplied CTR
LDO101 mA—
Buck ELR60 mA67%
Boost ELR242 mA70%
Inverting ELR157 mA71% a
  1. a See the section entitled “Design Note: Inverting ELR and Implied CTR” for details on the Inverting ELR CTR calculation.

Table 4 tells the efficiency story in another way: reporting each configuration’s input current required to supply a 100 mA load. The input currents are reported at an input voltage above turn-on, where its relationship with input voltage is relatively invariant. The reduction in input current between the LDO and Buck ELR, from 101 mA to 60 mA, exemplifies the benefit of using Polaris optocouplers in this circuit topology; input current needed to supply a given output current is significantly reduced without the drawbacks of switching or magnetic components. In the last column of Table 4, the optocouplers’ CTR is calculated using the IIN/ILOADI_{\mathrm{IN}}/I_{\mathrm{LOAD}} expressions defined in Table 3. The range of 67%–71% agrees with expectations given that CTR varies with LED injection current, and a 100 mA load implies different injection current levels for the different configurations. For the Buck and Inverting ELRs, input current will be equivalent to the LED injection current. The Boost ELR’s input current is split between two paths: 1) the pass transistor and LEDs; and 2) the PVs and load. Thus, LED injection current for the Boost ELR was approximately 142 mA when supplying 100 mA to the load. The calculated CTR values are in good agreement with our OC1D datasheet [8]; for this size of optocoupler, the CTR peaks between approximately 100 mA and 200 mA LED injection current.

Figure 4 compares load regulation across the four boards, each measured at a fixed input voltage (5.5 V, 2.5 V, 3.5 V, and 3.3 V for the Buck ELR, LDO, Boost ELR, and Inverting ELR, respectively). In order to provide an “apples-to-apples” comparison, each trace plots the change in ∣VOUT∣|V_{\mathrm{OUT}}| relative to its own value at 100 mA load current—a percent change. This allows us to compare the 5 V output Boost ELR with the other three while controlling for feedback divider error, which would be nearly 3× higher for a 5 V output relative to 1.8 V. Additionally, by plotting the magnitude of the output, the Inverting ELR shares sign convention with the other three topologies. In all four designs, the output voltage moves toward zero with increasing load. The Boost ELR and LDO track each other at approximately −0.2%/A, while the Buck and Inverting ELRs run about a factor of two steeper. In absolute terms every slope is below 10 mV/A, from 3.6 mV/A for the LDO to 9.1 mV/A for the Boost ELR, equivalent to a closed-loop output resistance under 10 mΩ.

Load regulation plot of the percent change in output-voltage magnitude from its 100 mA value versus load current from 0 to 900 mA. Every trace falls with load. Fitted slopes: Inverting ELR about −0.45%/A and Boost ELR about −0.18%/A over their shorter load ranges, LDO about −0.20%/A reaching about −0.16% at 900 mA, and Buck ELR about −0.39%/A reaching about −0.30% at 900 mA.
Figure 4. Load regulation of the four boards: percent change in ∣VOUT∣|V_{\mathrm{OUT}}| from its value at 100 mA, versus load current at 25 °C. Each label is the slope of a linear fit to that trace over its measured load range.

Figure 5 shows how each board recovers from a load step of 87–98 mA and from the matching release, with Table 5 reporting the dip, overshoot, settled shift, and settling time. Each board was tested at the same input voltage as in the load regulation test, and the output was probed at the output-capacitor pad with 20 MHz bandwidth and a 100-trace average. As in Figure 4, the magnitude of the output is plotted so the Inverting ELR shares the sign convention of the other three. The three ELRs are largely indistinguishable from one another: each dips 6–7 mV, overshoots 5–6 mV on release, rings briefly at a few hundred kilohertz, and settles within 2 mV in 9–16 µs, whether the optocouplers are arranged for step-down, step-up, or inversion. The LDO responds slightly faster and dips 1–1.5 mV less, which is consistent with the ELRs’ LED pair in series with Q1’s source: its dynamic resistance lowers the loop’s effective transconductance, and with it the crossover frequency, by a modest amount. The settled voltage shift after each load change, 0.4–1.0 mV, matches the load-regulation slopes of Figure 4 for the same current step to within 0.25 mV. Because nothing switches, the response contains no component at a switching frequency for a downstream clock or oscillator to pick up. Thus, the transient response is that of the feedback loop itself, which the optocouplers leave essentially untouched.

Two stacked plots of the change in output-voltage magnitude, in millivolts, versus time from −5 to 60 µs for the LDO, Buck ELR, Boost ELR and Inverting ELR. Top, load step: each trace dips at t = 0, the LDO to about −5 mV and the three ELRs to about −6 to −7 mV, then recovers within roughly 10 µs to a settled level about 0.5 to 1 mV below its starting point. Bottom, load release: each trace overshoots by about 5 to 6 mV, rings briefly, and settles near 1 mV within roughly 10 to 16 µs; a narrow spike at the release edge runs off the top of the axis.
Figure 5. Load-transient response of the four boards on shared axes: change in ∣VOUT∣|V_{\mathrm{OUT}}| from its pre-edge level for a load step (top) and a load release (bottom) at 25 °C. The 1.8 V boards step between 4 mA and 101 mA and the Boost ELR between 10 mA and 97 mA; the edge occurs at t=0t = 0. The brief spike at the release edge, about 20 mV for a few tens of nanoseconds, comes from the wiring between the board and the load, not from the regulator, and runs off the top of the lower panel.
Table 5. Load-transient summary from Figure 5. Dip and overshoot are the largest excursions of the regulator response after the edge; the settled shift is the post-edge level relative to the pre-edge level, averaged over the step and release captures; settling time is the last excursion beyond ±2 mV of the settled level.
ConfigurationStep dipRelease overshootSettled shiftSettling time, stepSettling time, release
LDO−5.1 mV4.9 mV0.4 mV6 µs9 µs
Buck ELR−6.5 mV5.5 mV0.7 mV10 µs16 µs
Boost ELR−6.1 mV5.3 mV1.0 mV9 µs10 µs
Inverting ELR−6.7 mV6.3 mV0.8 mV9 µs11 µs

LDO vs. Buck ELR Use Cases

Turn-on voltage versus load current is plotted in Figure 6 for the LDO and Buck ELR at 25 °C. This defines the input voltage range over which each board regulates. Both curves rise with load, because VfV_{f} and the drop across R5 and Q1 grow with current, so the designer must check the minimum input voltage against VONV_{\mathrm{ON}} at the maximum anticipated load rather than a nominal one. The LDO regulates from an input within 0.5 V of the output across the full 900 mA sweep and is the appropriate choice when the input rail sits close to the output. If the LDO-powered board was fed with 5 V, nearly two thirds of the input power would be dissipated in Q1 as illustrated in Figure 3. This is the regime that the Buck ELR was optimized to address: a stiff 5 V input regulates at up to 600 mA load. For operation at heavier loads, or with assured regulation across a wider input range, there are two convenient options when working with Polaris parts. The first, demonstrated in PSAN004, is a bypass path around the LED pair that automatically returns the ELR to conventional LDO operation whenever the input falls below a set threshold voltage [9]. Another option is to connect the two LEDs in parallel rather than in series, which lowers VONV_{\mathrm{ON}} by one LED forward drop and moves the Buck ELR’s operating range into the gap between the two curves in Figure 6.

Turn-on voltage versus load current from about 50 to 900 mA, labelled VOUT = 1.8 V. The Buck ELR curve rises from about 4.45 V to about 5.25 V; the LDO curve rises from about 1.8 V to about 2.3 V, leaving a gap of roughly 3 V between the two.
Figure 6. Turn-on voltage versus load current comparison for the Buck ELR and LDO at 25 °C.

Efficiency is one way to visualize the value of selecting an ELR for larger voltage steps. Another is thermal imaging, provided in Figure 7. We applied the same operating conditions of 5.5 V input, 1.8 V output supplying a 200 mA load to both the LDO and Buck ELR boards. On the LDO board, Q1 registered a maximum temperature of approximately 60 °C under these conditions—far hotter than any other component on the board. On the Buck ELR under identical conditions, Q1 wasn’t even the hottest component; U1 was, at approximately 39 °C. Two things are evident from Figure 7: the maximum temperature is significantly lower on the Buck ELR board, and its heat is more evenly distributed. The second point follows from where the power is routed. In the LDO nearly all of it is dissipated in Q1, whereas in the Buck ELR that dissipation is shared among Q1, U2, and U3. In total, the LDO and Buck ELR boards were measured to dissipate 788 mW and 335 mW, respectively, under these operating conditions (bias rail dissipation included). Table 6 summarizes the electrical operating point behind the two images.

FLIR thermal image of the LDO board on a 27.1 to 54.5 °C color scale: the EPC7014 transistor, labelled Q1, glows white-hot at the center of a broad red, yellow and green hot zone, and the LT1575 controller, labelled U1, sits just below it in yellow.
(a) LDO
FLIR thermal image of the Buck ELR board on the same 27.1 to 54.5 °C color scale: the board is almost uniformly dark blue, with the LT1575 controller, labelled U1, slightly warmer than its surroundings, and the transistor Q1 and the two optocouplers, labelled U2 and U3, barely distinguishable from the board.
(b) Buck ELR
Figure 7. FLIR thermal comparison of LDO and Buck ELR boards under equivalent operating conditions: 5.5 V to 1.8 V step-down supplying a 200 mA load, 25 °C ambient, natural convection. The color scale is fixed across both images to emphasize the ELR's impact on thermal dissipation.
Table 6. Measured operating point of the LDO and Buck ELR boards in Figure 7: 5.5 V input, 1.8 V output, 200 mA load, 25 °C ambient. PDP_{D} is total dissipated power including the bias rail.
LDOBuck ELR
VINV_{\mathrm{IN}} (V)5.55.5
IINI_{\mathrm{IN}} (mA)200119
VCCV_{\mathrm{CC}} (V)99
ICCI_{\mathrm{CC}} (mA)54
VOUTV_{\mathrm{OUT}} (V)1.7901.783
IOUTI_{\mathrm{OUT}} (mA)199.5199.6
PDP_{D} (mW)788.0334.5

Figure 8 extends the thermal comparison across load current. For each board we recorded the maximum temperature rise above ambient (ΔT\Delta T) at a series of steady-state operating points, all stepping 5.5 V down to 1.8 V, and plotted it against total dissipated power (PDP_{D}, bias rail included) and against total output power. Measurements were performed in a 25 °C ambient with natural convection, and a FLIR camera was used to quantify the maximum temperature on each board. The camera was set to a fixed emissivity of 0.95, which we take as a reasonable approximation for the packaged components on these boards. At low dissipated power, U1 was the hottest component on both boards: its own dissipation is nearly independent of load, so it sets a ΔT\Delta T floor of roughly 10 °C that the power-path components must exceed before they take over as the hotspot. On the LDO board, Q1 overtook U1 by approximately 0.45 W of total dissipation. On the Buck ELR board, U1 remained the hotspot until more than 1 W, and when a power-path component finally overtook it, that component was an optocoupler (U2 and U3 ran at nearly equal temperatures, as expected for the series-connected components) rather than Q1. A linear fit to max ΔT\Delta T versus PDP_{D} over the points where the power-path part registers the hotspot gives an effective thermal resistance—hotspot rise per watt of total board dissipation—of 46.5 °C/W for the LDO board and 23.3 °C/W for the Buck ELR board. The two boards share the same outline and layer stack, so this factor-of-two reduction comes largely from dividing the dissipation among three packages rather than concentrating it in one.

Two scatter plots of maximum temperature rise above ambient, from about 10 to 43 °C. Left, versus total dissipated power: the LDO board points (dark blue circles) climb steeply once Q1, the EPC7014, becomes the hotspot near 0.45 W, reaching about 42 °C at about 1 W, while the Buck ELR board points (light blue squares) rise about half as steeply, with the optocoupler hotspot taking over above 1 W and reaching about 39 °C at about 1.8 W; at low power both boards sit near 10 °C with the LT1575 as the hotspot. Right, versus total output power: the LDO board reaches about 42 °C at about 0.43 W of output, while the Buck ELR board reaches about 39 °C at about 1.5 W of output.
Figure 8. Maximum temperature rise above ambient (ΔT\Delta T) on the LDO (dark blue circles) and Buck ELR (light blue squares) boards versus total dissipated power (left panel) and total output power (right panel). Both boards step 5.5 V down to 1.8 V with load current swept; 25 °C ambient, natural convection, VCCV_{\mathrm{CC}} = 12 V. Dissipated power includes the bias rail. Open markers indicate that the hottest component was U1 (LT1575); closed markers indicate it was the power component labeled in the plot.

The right panel replots the same ΔT\Delta T data against total output power, which is the view a designer sizing a rail cares most about. Here the efficiency and thermal advantages compound: at the same maximum temperature rise, the Buck ELR board delivers more than three times the output power of the LDO board.

Noise & Ripple

Power supply ripple rejection (PSRR)—the ratio of ripple arriving at the input to the ripple persisting at the output—is plotted in Figure 9 for all four boards at 100 mA load, each supplied from an input between 0.5 V and 1 V above its turn-on voltage. The three boards regulating to 1.8 V in magnitude (LDO, Buck ELR, Inverting ELR) track one another within about 3 dB from 10 Hz to 300 kHz: each rejects 95 dB to 100 dB at low frequency, then falls gradually above 200 Hz to a floor of roughly 58 dB. The Boost ELR is the exception, holding 87 dB to 90 dB below 200 Hz, roughly 10 dB under the other three. The most likely cause is its output voltage of 5 V rather than 1.8 V. Its feedback divider lowers loop gain by 1 + R3/R4, which is 4.2 against 1.5 for the 1.8 V boards, a 2.8× or 9 dB reduction, so the divider alone predicts nearly all of the observed gap. The feedforward capacitor C6 mitigates this penalty: above a few hundred hertz the divider’s attenuation rolls off toward unity, and by 3 kHz the four traces have converged. A second, smaller contribution may come from the topology itself. In the Boost ELR the PV pair bridges input and output, so input ripple reaches the output node directly and must be cancelled by the loop rather than blocked by the pass transistor, as it is in the other three boards. Our earlier boost-versus-buck comparison of a co-packaged part at matched output voltage measured that effect at approximately 5 dB [7]; here, with the divider already accounting for most of the gap, it appears to be the lesser factor. All four boards recover to between 68 dB and 74 dB near 1 MHz, which coincides with the self-resonance of C5, where the impedance of the single 22 µF ceramic is lowest; no bulk capacitor or additional filtering was needed. Among Polaris Semiconductor’s ELR families, only BK30 rejects more: at 100 Hz the 1.8 V boards’ 100 dB sits just below BK30’s greater than 100 dB and well above the 75 dB of BK19.

PSRR in dB versus frequency from 10 Hz to 3 MHz for the LDO, Buck ELR, Boost ELR and Inverting ELR. The LDO, Buck ELR and Inverting ELR traces overlap, starting between about 95 and 100 dB at low frequency and falling above about 200 Hz to a floor near 58 dB around 100 kHz. The Boost ELR trace starts lower, near 87 to 90 dB, and joins the others by about 3 kHz. All four rise to a peak of about 68 to 74 dB near 1 MHz.
Figure 9. Power supply ripple rejection versus frequency for all four boards at 100 mA load current. Each board is supplied from an input voltage between 0.5 V and 1 V above its turn-on voltage; VCCV_{\mathrm{CC}} = 12 V, C5C_{5} = 22 µF ceramic, 25 °C. Input capacitor C3 was removed for this measurement so that it would not shunt the injected ripple.

Output noise spectral density—the noise voltage found in each 1 Hz slice of the spectrum—is plotted in Figure 10 for all four boards at 100 mA load. The three boards regulating to 1.8 V in magnitude (LDO, Buck ELR, Inverting ELR) are nearly indistinguishable from 10 Hz to 1 MHz. This supports our general findings that the incorporation of optocouplers in any of these arrangements leaves its output noise essentially that of the underlying regulator. The Boost ELR was expected to register higher noise at low frequency, and it does, by a factor of about 2.8 at 100 Hz. The cause is its 5 V output rather than its optocouplers. The same feedback divider that lowered its low-frequency PSRR also amplifies the controller’s reference and error-amplifier noise by 1 + R3/R4, and the 2.8 ratio between the two divider factors is the ratio seen in the figure. As with PSRR, C6 rolls the noise gain off toward unity above a few hundred hertz, and by 3 kHz the four traces have converged. Table 7 integrates the same spectra from 10 Hz–100 kHz, yielding 35 µVRMS for the three 1.8 V magnitude boards and 41 µVRMS for the 5 V Boost ELR board.

Log-log plot of output noise spectral density in nV per root hertz versus frequency from 10 Hz to 1 MHz for the four boards. The LDO, Buck ELR and Inverting ELR traces overlap, rising from roughly 70 to 100 nV per root hertz at 10 Hz to about 170 nV per root hertz near 100 Hz, then easing to about 110 nV per root hertz from 1 kHz to 100 kHz. The Boost ELR trace is about 2.8 times higher near 100 Hz, roughly 450 nV per root hertz, and converges with the others by about 3 kHz. All four roll off steeply above 100 kHz.
Figure 10. Output noise spectral density of all four topologies operating with 100 mA load current. Input voltage varies based upon topology; in all cases a voltage was applied between 0.5 V and 1 V above VONV_{\mathrm{ON}}; VCCV_{\mathrm{CC}} = 12 V.
Table 7. Total integrated RMS output noise from 10 Hz–100 kHz. Measurement conditions identical to Figure 10.
ConfigurationOutput Noise
LDO35 µVRMS
Buck ELR35 µVRMS
Boost ELR41 µVRMS
Inverting ELR35 µVRMS

Conclusions

This application note has shown, on four boards sharing one controller, one eGaN pass transistor, and one bill of materials, that linear regulation for space now covers voltage steps that were previously left to switching converters. Each board is tailored to a different operational range. The LDO regulates from an input within approximately 0.5 V of its 1.8 V output across a 1 A load sweep, with better than 90 dB of low-frequency ripple rejection, and it is the efficient answer for small voltage steps. The Buck ELR picks up where the LDO’s range ends, supplying the same 1.8 V from a 5 V input at approximately 60% efficiency and drawing 60 mA to serve a 100 mA load. Run side by side at 5.5 V input and 200 mA load, the two boards show what the optocouplers recover: 335 mW dissipated on the Buck ELR board against 788 mW on the LDO, a hotspot that rose 23.3 °C per watt against 46.5 °C/W, and more than three times the output power at equal temperature rise. The Boost ELR produces a 5 V rail from a single-cell Li-ion input at approximately 60% efficiency, and the Inverting ELR produces −1.8 V from 3.5 V with no inductor and no switching, at the minimal cost of two optocouplers. All four boards hold output noise to 35–41 µVRMS.

EPC Space’s eGaN takes away the gate-oxide rupture and burnout mechanisms that bound rad-hard silicon MOSFETs under heavy ions, and Polaris Semiconductor’s optocouplers take away the efficiency ceiling and exclusively-step-down limitation that have confined linear regulation to small voltage steps, so a spacecraft’s most noise-sensitive rails can be served linearly across large drops, step-up, and inversion. The boards here use discrete parts sized for standard logic rails, with a commercial silicon controller closing the loop. Other input-output pairs follow from the number of optocouplers and the series or parallel arrangement of their LEDs and photovoltaic elements, and co-packaging the same elements shrinks the footprint well below that of alternative switching solutions. Future versions may go further and implement the error amplifier in GaN as well. Demonstration boards are planned for availability through Polaris Semiconductor, and custom configurations and co-packaging are supported jointly by EPC Space and Polaris Semiconductor.

Appendix

LDO Schematic

Full KiCad schematic of the LDO demonstration board: the LT1575 controller (U1) driving the EPC7014 eGaN transistor (Q1) with gate resistor R1 and Zener clamp D1, current-sense resistor R5, compensation network R2, C1 and C2, feedback divider R3 and R4 with feedforward capacitor C6, input, bias and output capacitors C3, C4 and C5, unpopulated footprints C7 to C10, SHDN jumper R6, turret terminals J1 to J6 and test points TP1 to TP5, with a Polaris Semiconductor title block.
Figure A1. Schematic for LDO Board.

Buck ELR Schematic

Full KiCad schematic of the Buck ELR demonstration board: the same LT1575 and EPC7014 circuit as the LDO board, with two OC1D optocouplers (U2 and U3) added; their LEDs connect in series between the EPC7014 source and the output, and their photovoltaic cells connect in series from ground to the output. Polaris Semiconductor title block.
Figure A2. Schematic for Buck ELR Board.

Boost ELR Schematic

Full KiCad schematic of the Boost ELR demonstration board: the same LT1575 and EPC7014 circuit, with the two OC1D optocouplers (U2 and U3) wired so that their series LEDs run from the EPC7014 source to ground and their series photovoltaic cells sit between the input and the output, and with the divider set for a 5 V output. Polaris Semiconductor title block.
Figure A3. Schematic for Boost ELR Board.

Inverting ELR Schematic

Full KiCad schematic of the Inverting ELR demonstration board: the same LT1575 and EPC7014 circuit, with the series LEDs of the two OC1D optocouplers (U2 and U3) running from the EPC7014 source to ground, their series photovoltaic cells connected from ground down to the negative output, and the controller's GND, compensation and SHDN networks returned to the −1.8 V output rail. Polaris Semiconductor title block.
Figure A4. Schematic for Inverting ELR Board.

LDO PCB Layout

Component placement drawing of the LDO board, showing the outlines and reference designators of Q1, D1, U1 and the passives clustered at the center, turret terminals J1 to J6 along the edges, and test points TP1 to TP5.
(a) Component locations
Front copper, solder paste and silkscreen of the LDO board on a red background, with the title LDO, eGaN Conventional Linear Regulator, EPC7014, 2.5 V to 1.8 V, labelled IN, GND, OUT and VBIAS terminals, and the EPC Space and Polaris Semiconductor logos.
(b) Front copper, paste, and silkscreen
Inner copper layer 1 of the LDO board: a near-solid copper plane perforated by stitching vias and terminal holes.
(c) Inner copper layer 1
Inner copper layer 2 of the LDO board: copper pours split into regions by narrow gaps, with via arrays and terminal holes.
(d) Inner copper layer 2
Rear copper layer of the LDO board: copper pours split into regions, with stitching vias and terminal holes.
(e) Rear copper

Buck ELR PCB Layout

Component placement drawing of the Buck ELR board, showing Q1, D1, U1, the optocouplers U2 and U3 and the passives clustered at the center, turret terminals J1 to J6 along the edges, and test points TP1 to TP5.
(a) Component locations
Front copper, solder paste and silkscreen of the Buck ELR board on a red background, with the title Buck, eGaN Enhanced Linear Regulator (ELR), EPC7014 × OC1D, 5 V to 1.8 V, labelled IN, GND, OUT and VBIAS terminals, and the EPC Space and Polaris Semiconductor logos.
(b) Front copper, paste, and silkscreen
Inner copper layer 1 of the Buck ELR board: a near-solid copper plane perforated by stitching vias and terminal holes.
(c) Inner copper layer 1
Inner copper layer 2 of the Buck ELR board: copper pours split into regions by narrow gaps, with via arrays and terminal holes.
(d) Inner copper layer 2
Rear copper layer of the Buck ELR board: copper pours split into regions, with stitching vias and terminal holes.
(e) Rear copper

Boost ELR PCB Layout

Component placement drawing of the Boost ELR board, showing Q1, D1, U1, the optocouplers U2 and U3 and the passives clustered at the center, turret terminals J1 to J6 along the edges, and test points TP1 to TP5.
(a) Component locations
Front copper, solder paste and silkscreen of the Boost ELR board on a red background, with the title Boost, eGaN Enhanced Linear Regulator (ELR), EPC7014 × OC1D, labelled IN, GND, OUT and VBIAS terminals, and the EPC Space and Polaris Semiconductor logos.
(b) Front copper, paste, and silkscreen
Inner copper layer 1 of the Boost ELR board: a near-solid copper plane perforated by stitching vias and terminal holes.
(c) Inner copper layer 1
Inner copper layer 2 of the Boost ELR board: copper pours split into regions by narrow gaps, with via arrays and terminal holes.
(d) Inner copper layer 2
Rear copper layer of the Boost ELR board: copper pours split into regions, with stitching vias and terminal holes.
(e) Rear copper

Inverting ELR PCB Layout

Component placement drawing of the Inverting ELR board, showing Q1, D1, U1, the optocouplers U2 and U3 and the passives clustered at the center, turret terminals J1 to J6 along the edges, and test points TP1 to TP5.
(a) Component locations
Front copper, solder paste and silkscreen of the Inverting ELR board on a red background, with the title Inverting, eGaN Enhanced Linear Regulator (ELR), EPC7014 × OC1D, 3 V to −1.8 V, labelled IN, GND, OUT and VBIAS terminals, and the EPC Space and Polaris Semiconductor logos.
(b) Front copper, paste, and silkscreen
Inner copper layer 1 of the Inverting ELR board: a near-solid copper plane perforated by stitching vias and terminal holes.
(c) Inner copper layer 1
Inner copper layer 2 of the Inverting ELR board: copper pours split into regions by narrow gaps, with via arrays and terminal holes.
(d) Inner copper layer 2
Rear copper layer of the Inverting ELR board: copper pours split into regions, with stitching vias and terminal holes.
(e) Rear copper

eGaN × ELR Bill of Materials

Table A1. Consolidated bill of materials for the four demonstration boards, as built. A filled marker (●) indicates the part is fitted on that board; an open marker (○) indicates an unpopulated footprint provided. Among fitted parts, only R3, R4, and the two optocouplers change between boards.
IDLDOBuckBoostInv.DescriptionPartManufacturer
C1●●●●10 pF ceramic C0GCL10C100JB81PNCSamsung Electro-Mechanics
C2●●●●1000 pF ceramic C0GCL10C102JB81PNCSamsung Electro-Mechanics
C3, C4●●●●1 µF ceramic X7RGCM21BR71E105KA56LMurata Electronics
C5●●●●22 µF ceramic X7RCL31B226KPHNNNESamsung Electro-Mechanics
C6●●●●47 nF ceramic X7RCL10B473KB8WPNCSamsung Electro-Mechanics
C7○○○○Extra output cap., 1206——
C8○○○○Extra input cap., 1210——
C9○○○○Latch-off timing cap., 0603——
C10○○○Extra output cap., 0603——
C10○FB-to-OUT cap., 0603——
C11○Extra output cap., 0603——
D1●●●●5.1 V Zener, 500 mWMM5Z5V1ST1Gonsemi
J1–J6●●●●Turret terminal pin2501-2-00-80-00-00-07-0Mill-Max Manufacturing Corp.
Q1●●●●Rad-hard eGaN HEMTEPC7014UBCEPC Space
R1●●●●12.4 Ω 0.5% 1/16WRR0816Q-12R4-D-10RSusumu
R2●●●●7.32 kΩ 0.5% 1/16WRR0816P-7321-D-84HSusumu
R3●●2.26 kΩ 0.5% 1/16WRR0816P-2261-D-35HSusumu
R3●7.15 kΩ 0.5% 1/16WRR0816P-7151-D-83HSusumu
R3●4.64 kΩ 0.5% 1/16WRR0816P-4641-D-65HSusumu
R4●●4.64 kΩ 0.5% 1/16WRR0816P-4641-D-65HSusumu
R4●●2.26 kΩ 0.5% 1/16WRR0816P-2261-D-35HSusumu
R5●●●●40 mΩ 1% 1/8WPE0805FRF070R04LYageo
R6●●●●0 Ω jumper, 0603560112116001Würth Elektronik
TP1, TP2, TP4●●●●Test point, red5010Keystone Electronics
TP3, TP5●●●●Test point, black5011Keystone Electronics
U1●●●●Linear controller, SO-8LT1575CS8#PBFAnalog Devices
U2, U3●●●Photovoltaic optocouplerOC1DQ16Polaris Semiconductor

References

  1. ”Radiation performance of enhancement-mode gallium nitride power devices.” EPC Space; Application Note AN001, 2022. Available: https://epc.space/documents/application-notes/AN001%20Radiation%20Performance%20of%20eGaN%20Power%20Devices.pdf
  2. EPC7014UBC 60 V Radiation Hardened Power eGaN® Datasheet. EPC Space; Datasheet, 2026. Available: https://epc.space/documents/datasheets/EPC7014UBC-datasheet.pdf
  3. M. P. Lumb, K. J. Schmieder, J. DeLombard, J. Carlin, L. Kaliszewski, A. Price, D. Hollingshead, and T. Grassman, “Breaking the rules of linear regulators: High efficiency buck and boost conversion without switching.” Polaris Semiconductor; White Paper PSWP001, 2025. Available: https://www.polarissemiconductor.com/techdocs/elr-white-paper
  4. LT1575 Ultrafast Transient Response, Low Dropout Regulators Adjustable and Fixed. Analog Devices; Datasheet, 1996. Available: https://www.analog.com/media/en/technical-documentation/data-sheets/15757f.pdf
  5. M. P. Lumb, K. J. Schmieder, L. Sanchez, and A. Radosevich, “Generating low-noise negative rails from positive supplies without switching.” Polaris Semiconductor; Application Note PSAN005, 2026. Available: https://www.polarissemiconductor.com/techdocs/psan005-inverting-regulator
  6. A. Pozo, “Using GaN FETs with controllers and gate drivers designed for silicon MOSFETs.” Bodo’s Power Systems, 2024. Available: https://epc-co.com/epc/Portals/0/epc/documents/articles/bp-022024.pdf
  7. K. J. Schmieder and M. P. Lumb, “Switching-free boost regulators: A compact, all-linear solution to stepping-up voltage.” Polaris Semiconductor; Application Note PSAN001, 2025. Available: https://www.polarissemiconductor.com/techdocs/psan001-switching-free-boost
  8. OC1D 1.2V-1.7V Input, 1V Output, Photovoltaic Optocoupler. Polaris Semiconductor; Datasheet, 2024.
  9. K. J. Schmieder and M. P. Lumb, “Designing for multiple power sources: Seamless performance optimization with enhanced linear regulators.” Polaris Semiconductor; Application Note PSAN004, 2026. Available: https://www.polarissemiconductor.com/techdocs/psan004-multi-source-power

Footnotes

  1. The Boost ELR also connects them to the input terminal. ↩

  2. An explanation of how this differs in ELR variants follows in the next section. ↩

  3. The measured dropout in Figure 3 is somewhat larger, roughly 0.5 V at 900 mA, which likely reflects Q1’s positive RDS(on)R_{\mathrm{DS(on)}} tempco under self-heating together with board interconnect resistance. ↩

  4. For example, 22 nF yields approximately 1.6 ms latch-off time. ↩

  5. Perhaps Figure 3 leaves you wondering whether ELRs can be optimized to address the input voltages spanning the gap between the demonstrated Buck ELR and LDO. We’re happy to say it is as simple as configuring the two LEDs in parallel rather than in series. Many of our co-packaged ELR parts are configured such that pinout connections can adjust the LED array between series and parallel strings—in addition to a bypass mode for running the ELR package like an LDO—facilitating optimization across a wide range of input voltages for any given part [3], [9]. ↩

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